Semiconductor device and method of producing semiconductor device

ABSTRACT

A semiconductor device composed of: a semiconductor substrate of a first conductivity type having a first impurity concentration; a belt-shaped impurity layer of the first conductivity type which is formed in the substrate so as to be spaced apart from a surface of the substrate and which has a second impurity concentration which is higher than the first concentration at a first depth from the surface of the substrate; a gate electrode formed on the substrate via a first insulating film; a second impurity layer of a second conductive type which is formed in the substrate on both sides of the gate electrode such as to be spaced apart from each other and has a third impurity concentration at a second depth from the surface of the semiconductor substrate, whose lower surface abuts against the first impurity layer or is present thereabove, the second impurity layer having a configuration projecting downward of the gate electrode at a portion thereof adjacent to the first impurity layer; side wall insulating films each formed on a side wall of the gate electrode; and a third impurity layer of the second conductivity type which is formed in the second impurity layer laterally of the side wall insulating film and has a fourth concentration higher than the third concentration.

This is a division of application Ser. No. 07/395,735 filed on Aug. 17,1989, now U.S. Pat. No. 5,060,033.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device, and moreparticularly to the structure of an MOS or MIS semiconductor device anda method of producing the same.

In recent years, the trend toward increasing levels of circuitintegration is underway in semiconductor devices. This also applies toMOS transistors, and the circuit dimensions of this type of device havebecome extremely small, reaching even submicron regions. As such a trendtoward smaller circuit dimensions progresses, a phenomenon calledpunch-through takes place in which a current flows between a source anda drain irrespective of the gate voltage. To solve this problem, amethod for increasing the density of impurities in a portion deeper thana substrate surface are known, as disclosed in Japanese PatentPublication No. 16194/1979 and Japanese Patent Laid-Open ApplicationsNos. 127273/1978, 180167/1985, and 235471/1985. A description will begiven of this method with reference to FIG. 2. In FIG. 2, referencenumeral 201 denotes a p-type semiconductor substrate, such as a P-typesilicon substrate; 202, an element isolating insulation film; 203, agate insulating film; 209, a source region and a drain region bothformed of an n-type layer of high-concentration impurities; 205, a gateelectrode; and 204, a p-type layer of impurities having a higherconcentration of impurities than the semiconductor substrate 201. Evenif the depletion layer of the drain spreads on application of a voltageto the drain, the spreading of the depletion layer is held by the p-typelayer of impurities 204, thereby preventing the occurrence of apunch-through.

In addition, if the trend toward smaller circuit dimensions is advancedwith a supply voltage fixed, deterioration of characteristics occurs dueto hot carriers. To solve this problem, a structure called an LDD(lightly doped drain) was proposed. However, a structure in whichfurther improvements are made on this LDD is disclosed in the followingliterature 1: Ching-Yeu Wei, J. M. Pimbley, Y. Nissan-Cohen, "Buried andGraded/Buried LDD structures for Improved Hot-Electron Reliability",IEEE Electron Device Lett., Vol. EDL-7, No. 6, pp. 380-382, Jun. 1986. Adescription of this structure will be given with reference to FIG. 3. InFIG. 3, reference numeral 301 denotes a p-type silicon substrate formedof a p-type semiconductor; 302, an element isolating insulating filmformed of an oxide film or the like; 303, a gate insulating film formedof an oxide film or the like; 305, a gate electrode; 309, a sourceregion and a drain region both formed of an n-type layer ofhigh-concentration impurities; 306, a source region and a drain regionboth formed of an n-type layer of low-concentration impurities; 308, aside wall insulating film; and 304, a p-type layer of impurities havinga higher concentration of impurities than the semiconductor substrate30. The source region and the drain region formed of the n-type layer306 of low-concentration impurities is deeper than the channel of anMOS-type transistor, and extends inwardly of the gate electrode. As aresult, since the passage of a circuit flowing through the channel isbent downward at a drain end, and a spot where hot carriers aregenerated also moves to the inside of the substrate, it has been knownthat the frequency at which the generated hot carriers jump into theinterface between the gate oxide film and the channel is reduced,thereby minimizing the deterioration rate of the MOS transistor due tohot carriers.

However, since in the conventional example shown in FIG. 2 theconcentration of impurities in a portion deeper than the substratesurface is made higher, a punch-through is unlikely to occur, but sinceno measures have been taken with respect to the concentration of anelectric field in the vicinity of a drain, there has been a problem inthat the characteristics become deteriorated due to hot carriers.

In addition, although in the conventional example shown in FIG. 3deterioration of the characteristics due to hot carriers is minimized,there has been a drawback in that since the source region and the drainregion project inwardly of the gate electrode, a drain depletion layerand a source depletion layer are liable to be connected to each other,possibly resulting in a punch-through. Furthermore, since the thresholdvoltage of the MOS transistor is also involved, if the p-type layer 304having a concentration of impurities higher than that of thesemiconductor substrate 301 is formed in the vicinity of the surface ofthe semiconductor substrate 301, an avalanche phenomenon is liable tooccur in the vicinity of the surface, with the adverse result that thedeterioration of the MOS transistor becomes great.

SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide an MOStransistor which prevents punchthrough even if the circuit dimensionthereof becomes very small and the deterioration of characteristicsthereof due to hot carriers is minimized, thereby overcoming theabove-described drawbacks of the conventional art.

To this end, according to one aspect of the present invention there isprovided a semiconductor device comprising: a semiconductor substrate ofa first conductivity type having a first concentration; a firstbelt-shaped impurity layer of the first conductivity type which isformed in the semiconductor substrate such as to be spaced apart from asurface of the semiconductor substrate and which has a secondconcentration which is higher than that of the first concentration at afirst depth from the surface of the semiconductor substrate; a gateelectrode formed on the semiconductor substrate via a first insulatingfilm; impurity regions of a second conductivity type which are formed inthe semiconductor substrate on both sides of the gate electrode such asto be spaced apart from each other and having a third concentration at asecond depth from the surface of the semiconductor substrate, the lowersurface of the regions abutting against the first impurity layer orbeing present thereabove, the impurity regions having a configurationprojecting downward of the gate electrode at a portion thereof adjacentto the first impurity layer; side wall insulating films each formed on aside wall of the gate electrode; and a second impurity layer of thesecond conductivity type which is formed in the impurity regionslaterally of the side wall insulating film and having a fourthconcentration higher than the third concentration.

According to another aspect of the present invention, there is provideda method of producing a semiconductor device, comprising the steps of:forming a first insulating film on a semiconductor substrate of a firstconductivity type; ion-implanting first impurities of the firstconductivity type into the semiconductor substrate; forming a gateelectrode on the first insulating film; ion-implanting second impuritiesof a second conductivity type opposite to the first conductive type ofthe semiconductor substrate into the semiconductor substrate with thegate electrode serving as a mask, in such a manner that a peak of theconcentration of the second impurities is lower than a peak of theconcentration of the first impurities; forming a side wall insulatingfilm on the gate electrode by means of a second insulating film; andion-implanting third impurities of the second conductivity type into thesemiconductor substrate with the gate electrode and the side wallinsulating film serving as masks.

The above and other objects, features and advantages of the presentinvention will become more apparent from the following detaileddescription of the invention when read in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1(a) to 1(h) are cross-sectional views of stages in a processaccording to an embodiment of a method of producing a semiconductordevice in accordance with the present invention, in which FIG. 1(h) is aschematic cross-sectional view illustrating an embodiment of thesemiconductor device in accordance with the present invention.

FIGS. 2 and 3 are schematic cross-sectional views of conventionalsemiconductor devices.

FIG. 4 is a schematic cross-sectional view illustrating anotherembodiment of the present invention.

FIG. 5 is a graph explaining Gm_(MAX).

FIG. 6 is a graph explaining L_(punch).

FIGS. 7 and 8 are graphs illustrating a profile of impurities in thedirection of the depth of a substrate.

FIGS. 9 to 12 are graphs respectively illustrating deterioration rate ofGm_(MAX) due to hot carriers and a minimum dimension L_(punch) at whicha punch-through takes place.

FIG. 13 is a diagram illustrating the time dependence of deteriorationin Gm due to hot carriers of an MOS transistor, in which A relates to anembodiment of the invention, while B relates to a conventional example.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A detailed description will be given of an embodiment of the presentinvention with reference to FIGS. 1(a) to 1(h). FIG. 1(h) is across-sectional view of an MOS transistor in a final process inaccordance with the present invention. As shown in FIG. 1(h), the MOStransistor in accordance with the present invention comprises asemiconductor substrate 101, e.g., a p-type silicon substrate; anelement isolating separating insulation film 102, e.g., a silicon oxidefilm; an insulating film 103, such as a gate insulating film constitutedby a silicon oxide film; a p-type layer 104 having an impurityconcentration higher than that of silicon substrate 101; a gateelectrode 105; source and drain regions 106 formed by an n-type layer oflow-concentration impurities; a side wall insulating film 108 formedfrom a silicon oxide film 107 or the like; and source and drain regions109 formed by an n-type layer of high-concentration impurities. Themark--indicates the location in layer 104 at which the concentration ofimpurities of the p-type layer of concentration impurities becomesmaximum. The mark X indicates the locations where the concentration ofimpurities of the n-type regions 106 of low-concentration impuritiesbecomes maximum.

First, as shown in FIG. 1(a), a semiconductor substrate of a firstconductivity type, i.e., the p-type silicon substrate 101 in this case,is subjected to oxidation at 1,000° C. in an oxidizing atmosphere so asto form a silicon oxide film with a 500 Å thickness. Subsequently, asilicon nitride film with a thickness of 2000 Å is formed by the CVDprocess. Then, after unnecessary portions of the silicon nitride filmare removed by a photoetching process, the silicon substrate 101 issubjected to oxidation at 1,000° C. in a wet atmosphere to form anelement isolating insulation film 103 constituted by an oxide film withan approximate 1 μm thickness, and the aforementioned silicon nitridefilm is then removed. Through these processes, the silicon oxide filmwhich serves as the element isolating insulation film 102 is formed onthe p-type silicon substrate 101, as shown in FIG. 1(a).

Subsequently, as shown in FIG. 1(b), the p-type silicon substrate 101 issubjected to oxidation at 1,000° C. in an oxidizing atmosphere, and agate insulating film 103 constituted by an oxide film with a 200 Åthickness is formed on the p-type silicon substrate 101.

Then, as shown in FIG. 1(c), p-type impurities, e.g., boron, areion-implanted at a dosage of 1×10¹² cm⁻² to 1×10¹⁴ cm⁻² and at anacceleration voltage of 60 KeV to 200 KeV to form the p-type layer 104having an impurity concentration higher than that of the siliconsubstrate.

Then, as shown in FIG. 1(d), after a polycrystalline silicon film havinga 6,000 Å is formed by the CVD process, unnecessary portions of thatfilm are removed by a photoetching process so as to form the gateelectrode 105.

Subsequently, as shown in FIG. 1(e), n-type impurities, e.g.,phosphorous are ion-implanted at a dosage of 1×10¹² cm⁻² to 1×10¹⁴ cm⁻²and at an acceleration voltage of 80 KeV to 180 KeV with the gateelectrode 105 and the element isolating insulation film 102, constitutedby the silicon oxide film, serving as masks so as to form the n-typelayer 106 of low-concentration impurities for the source and drainregions.

Then, as shown in FIG. 1(f), after the silicon oxide film 107 with a6000 Å thickness is formed on the semiconductor substrate 101 and thegate electrode 105 by means of the CVD process, reactive ion-etching isperformed so as to form the side wall insulating film 108 from thesilicon oxide film, as shown in FIG. 1(g).

Subsequently, as shown in FIG. 1(h), n-type impurities, e.g., arsenic,are ion-implanted at a dosage of 1×10¹² cm⁻² and at an accelerationvoltage of 80 KeV with the gate electrode 105, the side wall insulatingfilm 108, and the element isolating insulation film 102 serving as masksso as to form the n-type layer, or regions, 109 of high-concentrationimpurities for the source and drain regions.

Finally, to activate the ion-implanted layers, the MOS transistor issubjected to annealing at 800° C. to 1100° C. In the case of the MOStransistor thus formed, if the concentration of the p-type impurities ofthe p-type silicon substrate 101, i.e., the concentration of impuritiesof boron in this case, is set to 5×10¹⁵ cm⁻³, the maximum value of theconcentration of impurities of the n-type layer 106 of low-concentrationimpurities becomes 1×10¹⁶ cm⁻³ to 6×10¹⁸ cm⁻³, and a location at whichthe value becomes maximum is 0.05 to 0.25 μm deep from the surface ofthe silicon substrate, so that the n-type layer 106 of low-concentrationimpurities projects 0.05 to 0.15 μm inwardly of, or under, the gateelectrode 105.

In each of FIGS. 5, 9, 10, 11 and 12, to be described in detail below,there are two curves and two ordinate scales. Each curve is associatedwith an arrow pointing to its corresponding ordinate scale.

The curves of FIGS. 9, 10, 11, 12 and 13 were all made with a gatevoltage, V_(G), of +3V and a drain voltage, V_(D), OF +8V relative tothe substrate.

FIG. 9 is a graph illustrating the depth of the location at which theconcentration of impurities of the n-type layer 106 of low-concentrationimpurities becomes maximum, the deterioration rate of Gm due to hotcarriers, and the minimum dimension at which a punch-through takesplace. FIG. 10 is a graph illustrating the maximum value of theconcentration of the n-type layer 106 of low-concentration impurities,the deterioration rate of G_(MAX) due to hot carriers, and the minimumdimension at which a punch-through takes place. As for Gm_(MAX) referredto herein, the value of Gm is obtained by differentiating I_(D) withV_(G) in the graph of gate voltage V_(G) and drain current I_(D) of theMOS transistor, as shown in FIG. 5, and the maximum value of Gm is setas Gm_(MAX). In addition, as for the minimum dimension at which apunchthrough takes place, if a graph is plotted with respect to drainbreakdown voltage BVds and a gate length L when the gate is connected toground, as shown in FIG. 6, and if the gate length L becomes shorterthan a certain gate length, BVds starts to decline. Such a gate lengthis set as a minimum dimension L_(punch) at which a punch-through takesplace.

Both FIGS. 9 and 10 show favorable values with respect to both thedeterioration rate of Gm_(MAX) due to hot carriers and the minimumdimension at which a punch-through takes place in accordance with therange of the above-described embodiment. This can be considered asfollows: The deeper from the substrate surface the maximum concentrationof impurities of the n-type layer 106 of low-concentration impurities,the deeper from the substrate surface is the spot at which hot carriersare generated in the vicinity of a drain, so that the rate ofdeterioration of Gm_(MAX) due to hot carriers becomes small. However,since a punch-through is otherwise liable to occur, it is impossible todeepen the maximum concentration location unduly. There is an optimumrange for this location.

Furthermore, the effect of alleviation of an electric field in thevicinity of a drain changes due to the concentration of impurities ofthe n-type layer 106 of low-concentration impurities, so that the rateof deterioration of Gm_(MAX) also changes. In other words, the rate ofdeterioration of Gm_(MAX) due to hot carriers becomes large if thisconcentration of impurities is too high or too low.

In addition, since the tendency of occurrence of a punch-through alsochanges due to this concentration of impurities, there is an optimumrange. If it is assumed that the deterioration rate of Gm_(MAX) due tohot carriers is 8% or less and the minimum dimension at which apunch-through takes place is 0.8 μm, an optimal range of the location atwhich the concentration of impurities of the n-type layer 106 oflow-concentration impurities becomes maximum can be determined from FIG.9 to be 0.05 to 0.25 μm from the surface of the silicon substrate,preferably 0.08 to 0.2 μm for reducing the deterioration rate ofGm_(MAX) due to hot carriers, and more preferably 0.1 to 0.18 μm.

In addition, if it is assumed that the deterioration rate of Gm_(MAX)due to hot carriers is 8% or below and the minimum dimension at which apunch-through takes place is 0.8 μm, the optimal range of the peakconcentration of impurities of the n-type layer 106 of low-concentrationimpurities can be determined from FIG. 10 to be in the range of 1×10¹⁶cm⁻³ to 6×10¹⁸ cm⁻³, preferably 2×10¹⁶ cm⁻³ to 2×10¹⁸ cm⁻³ for reducingthe deterioration rate of Gm_(MAX) due to hot carriers, and morepreferably 1×10¹⁷ to 1×10¹⁸ cm⁻³.

In accordance with the above-described embodiment, the location at whichthe concentration of impurities of p-type impurity layer 104 having aconcentration higher than that of the silicon substrate becomes amaximum at a depth of 0.2 μm to 0.55 μm. FIGS. 7 and 8 show the profileof impurities in the direction of the depth of the n-type layer 106 oflow concentration impurities and the p-type impurity layer 104 in thiscase. FIG. 7 shows the profile of impurities where at a depth of 0.15 μmthe concentration of impurities of the n-type layer 106 oflow-concentration impurities become maximum and at a depth of 0.55 μmthe concentration of impurities of the p-type impurity layer 104 becomemaximum. Meanwhile, FIG. 8 shows the profile of impurities where at adepth of 0.15 μm the concentration of impurities of the n-type layer 106of low-concentration impurities become maximum and at a depth of 0.2 μmthe concentration of impurities of the p-type impurity layer 104 becomemaximum. As can be seen from FIGS. 7 and 8, looking at the overallconcentration of impurities in which n-type impurities and p-typeimpurities are offset with each other, a p-type region having a higherconcentration of impurities than that of the silicon substrate ispresent at a location deeper than the n-type layer 106 oflow-concentration impurities. In this case, both the deterioration rateof Gm_(MAX) due to hot carriers and the minimum dimension at which apunchthrough takes place show favorable values in FIGS. 11 and 12 in therange of the above-described embodiment. This can be considered asfollows: If a p-type layer 104 having a higher concentration ofimpurities than that of the silicon substrate 101 is formed at alocation deeper than the n-type layer 106 of low-concentrationimpurities due to the p-type impurity layer 104, the spreading of thedrain depletion layer can be held, so that it becomes difficult for apunch-through to take place. However, this does not mean that thelocation can be set too deep. If the location of the p-type impuritylayer 104 is set too deep, the depth of the p-type impurity layer 104becomes greater than that of the spreading region of the drain depletionlayer, so that it becomes impossible to restrain the spreading of thedrain depletion layer, with the adverse result that a punch-through isliable to occur.

In addition, since the location at which the concentration of impuritiesof the p-type impurity layer 104 becomes maximum is set deep, the spotwhere the avalanche phenomenon occurs in the vicinity of a drain due toa drain electric field is brought to a position deep from the substrate,the deterioration rate of Gm due to hot carriers is lowered.Nevertheless, if the depth of the p-type impurity layer 104 is set lowerthan a certain position, the spot where the avalanche phenomenon occursdoes not change, so that the deterioration rate of Gm_(MAX) is notimproved to a remarkable extent.

From the foregoing description, it can be seen that an optimal rangeexists with respect to the location where the concentration ofimpurities of the p-type impurity layer 104 becomes maximum. If it isassumed that the deterioration rate of Gm_(MAX) due to hot carriers is8% or less and that the minimum dimension at which a punch-through takesplace is 0.8 μm, that range can be determined from FIG. 11 as being inthe range of 0.2 μm to 0.7 μm from the surface of the silicon substrate,preferably 0.25 μm to 0.55 μm, and more preferably 0.3 μm to 0.5 μm fromthe surface where hot carriers and the punch-through takes place. Inaddition, FIG. 12 is a graph illustrating the maximum value of theconcentration of impurities in the p-type impurity layer 104, thedeterioration rate of Gm_(MAX) due to hot carriers, and the minimumdimension at which a punch-through takes place. From this graph, therange of the maximum value of the concentration of impurities of thep-type impurity layer 104 can be determined to be in the range of 1×10¹⁶cm⁻³ to more preferably 1×10¹⁷ cm⁻³ to 1×10¹⁸ cm⁻³.

FIG. 13 is a graph illustrating the time dependence of deterioration ofGm due to hot carriers in MOS transistors according to theabove-described embodiment of the invention and an example of the priorart, in which A relates to the invention and B relates to the prior art.This diagram reveals that the deterioration rate of Gm in accordancewith the invention is approximately 1/5 that of the prior art.

Although in this embodiment, boron is used as the p-type impurity of thep-type impurity layer 104, aluminum, gallium, or indium mayalternatively be used, or a combination of such impurities, such asboron and aluminum, may be used. In addition, although phosphorous isused as the n-type impurity in the n-type layer 106 of low-concentrationimpurities, arsenic or antimony may be used, or a combination of suchimpurities, such as arsenic and phosphorous, may be used.

In addition, although in this embodiment a polycrystalline silicon filmis used for the gate electrode, a refractory metal such as titanium,molybdenum, or tungsten may be used, or a refractory metal polycide filmin which a refractory metal such as titanium, molybdenum, or tungsten ora silicide thereof is formed on a semiconductor film such as apolycrystalline silicon film, or a refractory metal itself or a silicidethereof itself may be used. Furthermore, although in this embodiment asilicon oxide film formed by the CVD process is used as the side wallinsulating film, a silicon oxide film obtained by thermally oxidizing apolycrystalline silicon film may be used, or a silicon nitride film maybe used. Moreover, although in this embodiment the element isolatingregion is formed by the LOCOS process, it is possible to use the trenchisolation process in which, after a trench is provided in thesemiconductor substrate, the one obtained by embedding the trench withan insulating film such as an oxide film is used as the elementisolating region (see FIG. 4).

In this embodiment, if the transistor shown in FIG. 1 is used as atransistor constituting a flip-flop of a memory cell of an SRAM, strongprotection can be obtained against soft errors caused by d-particles. Ifd-particles penetrate into the n-type diffusion layer in a drain regionof the transistor constituting a flip-flop of an SRAM, pairs ofelectrons and holes are generated in a depletion layer formed between ann+ diffusion layer and a p-type substrate. The generated electrons aredrawn by an electric field in the direction of a drain of the transistorand are injected into the drain diffusion layer. At this time, if thedrain diffusion layer is in the high state of the flip-flop, thepotential is lowered by the injected electrons, so that the high stateturns to the low state. This is the soft error due to d-particles.However, in the embodiment shown in FIG. 1(h), even if the draindiffusion layer is in the high state, the width of the depletion layerbecomes narrow due to the n-type impurity layers 106, 109 and the p-typeimpurity layer 104. In this case, even if d-particles penetrate into then-type diffusion layer in the drain region, since the width of theaforementioned depletion layer is made narrow, the number of pairs ofelectrons and holes generated in the depletion layer becomes small, sothat strong protection against soft errors caused by d-particles can beobtained.

Although the embodiment described is an n-channel transistor, it goeswithout saying that a similar effect can be obtained if the presentinvention is applied to a p-channel transistor.

In accordance with the present invention, since a punch-throughphenomenon is unlikely to occur, MOS transistors can be provided withvery short channels up to submicron size, which allows not only highlevels of integration and high speed of LSIs to be attained but also therate of deterioration of characteristics due to hot carriers can beminimized. In addition, if the MOS device is used for a memory cell ofan SRAM, its protection against soft errors caused by d-particles can beenhanced. Hence, there is an advantage in that the present inventionplays a large role in improving the reliability of LSIs.

While the description above refers to particular embodiments of thepresent invention, it will be understood that many modifications may bemade without departing from the spirit thereof. The accompanying claimsare intended to cover such modifications as would fall within the truescope and spirit of the present invention.

The presently disclosed embodiments are therefore to be considered inall respects as illustrative and not restrictive, the scope of theinvention being indicated by the appended claims, rather than theforegoing description, and all changes which come within the meaning andrange of equivalency of the claims are therefore intended to be embracedtherein.

what is claimed is:
 1. A method of producing a semiconductor devicecomprising the steps of:forming a first insulating film on a surface ofa semiconductor substrate of a first conductivity type; ion-implantingfirst impurities of said first conductivity type into said semiconductorsubstrate to create a first impurity concentration having a peak;forming a gate electrode on said first insulating film; ion-implantingsecond impurities of a second conductivity type opposite to said firstconductivity type of said semiconductor substrate into saidsemiconductor substrate to create a second impurity concentration havinga peak, with said gate electrode serving as a mask, in such a mannerthat the peak of the concentration of said second impurities is at ashallower depth than the peak of the concentration of said firstimpurities; forming a side wall insulating film on said gate electrode;and ion-implanting third impurities of said second conductivity typeinto said semiconductor substrate with said gate electrode and said sidewall insulating film serving as masks.
 2. A method of producing asemiconductor device according to claim 1 wherein said side wallinsulating film is formed by depositing a second insulating film on saidsemiconductor substrate and said gate electrode; and anisotropicallyion-etching the second insulating film.
 3. A method of producing asemiconductor device according to claim 2 wherein the first impurityconcentration peak is at a depth from the surface of the semiconductorsubstrate of 0.2 to 0.7 μm.
 4. A method producing a semiconductor deviceaccording to claim 3 wherein the peak concentration of said firstimpurities in said semiconductor substrate is in the range of 1×10¹⁶ to3×10¹⁸ cm⁻³.
 5. A method of producing a semiconductor device accordingto claim 1 wherein the first impurity concentration peak is at a depthfrom the surface of the semiconductor substrate of 0.2 to 0.7 μm.
 6. Amethod producing a semiconductor device according to claim 5 wherein thepeak concentration of said first impurities in said semiconductorsubstrate is in the range of 1×10¹⁶ to 3×10¹⁸ cm⁻³.
 7. A methodproducing a semiconductor device according to claim 2 wherein the peakconcentration of said first impurities in said semiconductor substrateis in the range of 1×10¹⁶ to 3×10¹⁸ cm⁻³.
 8. A method producing asemiconductor device according to claim 1 wherein the peak concentrationof said first impurities in said semiconductor substrate is in the rangeof 1×10¹⁶ to 3×10¹⁸ cm⁻³.
 9. A method of producing a semiconductordevice according to claim 8 wherein the second impurity concentrationpeak is at a depth from the surface of said semiconductor substrate of0.05 to 0.25 μm.
 10. A method of producing a semiconductor deviceaccording to claim 9 wherein the peak concentration of said secondimpurities in said semiconductor substrate is in the range of 1×10¹⁶ to6×10¹⁸ cm⁻³.
 11. A method of producing a semiconductor device accordingto claim 2 wherein the second impurity concentration peak is at a depthfrom the surface of said semiconductor substrate of 0.05 to 0.25 μm. 12.A method of producing a semiconductor device according to claim 11wherein the peak concentration of said second impurities in saidsemiconductor substrate is in the range of 1×10¹⁶ to 6×10¹⁸ cm⁻³.
 13. Amethod of producing a semiconductor device according to claim 1 whereinthe second impurity concentration peak is at a depth from the surface ofsaid semiconductor substrate of 0.05 to 0.25 μm.
 14. A method ofproducing a semiconductor device according to claim 1 wherein the peakconcentration of said second impurities in said semiconductor substrateis in the range of 1×10¹⁶ to 6×10¹⁸ cm⁻³.